深圳市太航半导体有限公司

6年

深圳市太航半导体有限公司

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K3MF8F80DM-MGCE    原装现货欢迎询价
K3MF8F80DM-MGCE    原装现货欢迎询价
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K3MF8F80DM-MGCE 原装现货欢迎询价

批号:

新年份

型号:

K3MF8F80DM-MGCE

厂家:

SAMSUNG三星

封装:

BGA

产品信息

K3MF8F80DM-MGCE

K3MF8F80DM-MGCE

K3MF8F80DM-MGCE


• Core: Arm® 32-bit Cortex®-M3 CPU

– 72 MHz maximum frequency, 1.25 DMIPS/MHz

(Dhrystone 2.1) performance at 0 wait state

memory access

– Single-cycle multiplication and hardware

division

• Memories

– 256 to 512 Kbytes of Flash memory

– up to 64 Kbytes of SRAM

– Flexible static memory controller with 4 Chip

Select. Supports Compact Flash, SRAM,

PSRAM, NOR and NAND memories

– LCD parallel interface, 8080/6800 modes

• Clock, reset and supply management

– 2.0 to 3.6 V application supply and I/Os

– POR, PDR, and programmable voltage detector

(PVD)

– 4-to-16 MHz crystal oscillator

– Internal 8 MHz factory-trimmed RC

– Internal 40 kHz RC with calibration

– 32 kHz oscillator for RTC with calibration

• Low power

– Sleep, Stop and Standby modes

– VBAT supply for RTC and backup registers

• 3 × 12-bit, 1 μs A/D converters (up to 21

channels)

– Conversion range: 0 to 3.6 V

– Triple-sample and hold capability

– Temperature sensor

• 2 × 12-bit D/A converters

• DMA: 12-channel DMA controller

– Supported peripherals: timers, ADCs, DAC,

SDIO, I2Ss, SPIs, I2Cs and USARTs