- 非IC关键词
深圳市太航半导体有限公司
- 卖家积分:营业执照:已审核经营模式:贸易/代理/分销所在地区:广东 深圳企业网站:
http://www.thicg.com/
收藏本公司 人气:203954
企业档案
相关产品
产品信息
FEATURES
Technology:
55nm TSMC Embedded Flash (Flash + SRAM) process technology
Packaging:
Low cost and small package sizes
Multiple device densities with compatible package footprints for seamless migration between different device densities 5AGXBA5D6F31C6N
RoHS6-compliant 5AGXBA5D6F31C6N
Core Architecture: 5AGXBA5D6F31C6N
4-input look-up table (LUT) and single register Logic Element (LE)
LEs arranged in Logic Array Block (LAB)
Embedded RAM and user flash memory
Clocks and PLLs
Embedded multiplier blocks 5AGXBA5D6F31C6N
General purpose I/Os
Internal Memory Blocks:
M9K — 9-kilobits (Kb) memory blocks
Cascadable blocks to create RAM, dual port, and FIFO functions
User Flash Memory:
User accessible non-volatile storage
High speed operating frequency
Large memory size
High data retention
Multiple interface option
Embedded Hard IP Embedded Multiplier Blocks:
Support for one 18 x 18 or two 9 x 9 multiplier modes
Cascadable blocks enabling creation of filters, arithmetic functions, and image processing pipelines
ADC:
12-bits successive approximation register (SAR) type
Up to 17 analog inputs
Cumulative speed up to 1 million samples per second (MSPS)
Integrated temperature sensing capability